Features of Datacon product The 2200 apm+ is fully integrated in Datacon's unique platform concept. 300 mm Wafer processing In the loading and unloading of the 2200 apm+ with 300 mm wafer magazines, special attention was paid to the SEMI-compliant design of the transfer height.
Multi Chip Module In just one module, the 2200 apm+ can flip the die, dip it in the dipping unit, and accurately place the component . Flip Chip and die attach or any combination of these are also possible, as placing various chips on a substrate on top of or next to each other all in one module!
Small Footprint - 2200 apm+ has a footprint of just 1000 x 1200 x 1800 mm Flip-Chip-Bonder by die-bonding.net |
